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企业概况
截至2026年6月
HANMI Semiconductor CO., LTD. was established in 1980 and, starting with the development and launch of semiconductor manufacturing equipment such as the DUAL TC BONDER, HBM 6-SIDE INSPECTION, micro SAW&VISION PLACEMENT, FLIP CHIP BONDER, EMI Shield VISION ATTACH/DETACH, camera module equipment, LASER EQUIPMENT, META GRINDER, TAPE SAW, and WAFER SAW, has extended its own technology to state-of-the-art automation equipment, operating an integrated production line covering design, manufacturing, assembly, inspection, and test. It has secured global competitiveness in the semiconductor industry and has been supplying equipment to major global semiconductor manufacturers. Its flagship equipment, the 'DUAL TC (Thermal Compression) BONDER,' is thermal compression bonding equipment essential for producing High Bandwidth Memory (HBM) semiconductors, connecting wafer to wafer to enable 2.5D and 3D semiconductor structures, and it has been co-developed with SK Hynix and supplied since 2017.
代表理事
Gwak Dongsin
成立日期
1980年12月24日
法人类型
韩国综合股价指数
行业分类
Manufacture of semi-conductor manufacturing machinery
法人注册号
12011-0038423
营业执照号
137-81-02051
电话号码
032-571-9100
传真号码
(032)578-5557
公司地址
인천광역시 서구 가좌로30번길 14
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