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HANMI Semiconductor CO., LTD. 042700
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Company Summary

Quarterly Performance Revenue Operating Margin

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Company Overview

as of June 2026
HANMI Semiconductor CO., LTD. was established in 1980 and, starting with the development and launch of semiconductor manufacturing equipment such as the DUAL TC BONDER, HBM 6-SIDE INSPECTION, micro SAW&VISION PLACEMENT, FLIP CHIP BONDER, EMI Shield VISION ATTACH/DETACH, camera module equipment, LASER EQUIPMENT, META GRINDER, TAPE SAW, and WAFER SAW, has extended its own technology to state-of-the-art automation equipment, operating an integrated production line covering design, manufacturing, assembly, inspection, and test. It has secured global competitiveness in the semiconductor industry and has been supplying equipment to major global semiconductor manufacturers. Its flagship equipment, the 'DUAL TC (Thermal Compression) BONDER,' is thermal compression bonding equipment essential for producing High Bandwidth Memory (HBM) semiconductors, connecting wafer to wafer to enable 2.5D and 3D semiconductor structures, and it has been co-developed with SK Hynix and supplied since 2017.
Representative Director Gwak Dongsin
Founded December 24, 1980
Corporation Type KOSPI
Industry Classification Manufacture of semi-conductor manufacturing machinery
Corporate number 12011-0038423
Business number 137-81-02051
Phone Number 032-571-9100
Fax Number (032)578-5557
Company Address 인천광역시 서구 가좌로30번길 14
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